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Gallium nitride HEMT epitaxial products

·Silicon based gallium nitride LED epitaxial wafers (2 inches, 4 inches, 6 inches, 8 inches)
·D-mode and E-mode
·Breakdown voltage 800V to 1200V
Usage: Mobile RF switch, fast charging, wireless charging, data center, new energy vehicle charging and other fields
Epitaxial Epi
Crystal
1.1 Growing Method MOCVD
1.2 Orientation <111> crystal orientation
1.3 thickness 5~5.5um
1.4 Surface coverage/thickness GaN /2-2.5nm
1.5GaN quality <600”(002 )
<1000”(102)
1.6 HEMT component AlxGal-xN,0.2
1.7 ALN intermediate layer 1-2nm
Electrical
Two-dimensional electron gas concentration of HEMT structure >8E12/cm²
Mechanical
Diameter 150±0.2mm
Surface Treatment
Crack (Edge 5 mm) without
Substrate
Surface Treatment
Crack (Edge 5 mm) without